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1. product profile 1.1 general description high-voltage, high-speed planar-passivated npn power switching transistor in a sot186a (to-220f) plastic package. 1.2 features and benefits ? fast switching ? high voltage capability ? isolated package ? low thermal resistance 1.3 applications ? dc-to-dc converters ? high-frequency elec tronic lighting ballast applications ? inverters ? motor control systems 1.4 quick reference data BUJ302AX npn power transistor rev. 02 ? 28 march 2011 product data sheet to- 220f table 1. quick reference data symbol parameter conditions min typ max unit i c collector current see figure 1 ; see figure 2 ; see figure 4 --4a p tot total power dissipation t h 25 c; see figure 3 --26w v cesm collector-emitter peak voltage v be =0v --1050v static characteristics h fe dc current gain i c =0.1a; v ce =5v; t h =25c; see figure 11 48 66 100 i c =0.8a; v ce =3v; t h =25c; see figure 12 25 42 50
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 2 of 13 nxp semiconductors BUJ302AX npn power transistor 2. pinning information 3. ordering information 4. limiting values table 2. pinning information pin symbol description simplified outline graphic symbol 1 b base sot186a (to-220f) 2 c collector 3eemitter mb n.c. isolated 3 2 1 mb sym123 c e b table 3. ordering information type number package name description version BUJ302AX to-220f plastic single-ended pa ckage; isolated heatsink mounted; 1 mounting hole; 3-lead to-220 "full pack" sot186a table 4. limiting values in accordance with the absolute maxi mum rating system (iec 60134). symbol parameter conditions min max unit v cesm collector-emitter peak voltage v be = 0 v - 1050 v v ceo collector-emitter voltage i b = 0 a - 400 v i c collector current see figure 1 ; see figure 2 ; see figure 4 -4a i cm peak collector current - 8 a i b base current dc - 2 a i bm peak base current - 4 a p tot total power dissipation t h 25 c; see figure 3 -26w t stg storage temperature -65 150 c t j junction temperature - 150 c v ebo emitter-base voltage i c =0a; i e =2a; t p < 10 ms - 24 v
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 3 of 13 nxp semiconductors BUJ302AX npn power transistor fig 1. reverse bias safe operating area fig 2. test circuit for reverse bias safe operating area fig 3. normalized total power dissipation as a function of heatsink temperature 003aag027 v ceclamp (v) 0 1200 800 400 4 6 2 8 10 i c (a) 0 001aab999 dut l c l b i bon v bb v cc v cl(ce) probe point 03aa13 0 40 80 120 0 50 100 150 200 t h ( c) p der (%)
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 4 of 13 nxp semiconductors BUJ302AX npn power transistor 1)ptot maximum and ptot peak maximum lines 2)second breakdown limits 3) i = region of permissable dc operation ii = extension for repetitive pulse operation iii = extension during turn-on in single transistor converters provided that rbe 100 ? and tp 0.6 s fig 4. forward bias safe operating area for tmb 25 c 001aac001 10 ? 1 10 ? 2 10 1 10 2 i c (a) 10 ? 3 v ceclamp (v) 1 10 3 10 2 10 (1) 100 s 200 s i (3) t p = 20 s duty cycle = 0.01 50 s 500 s dc ii (3) iii (3) (2) i cm(max) i c(max)
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 5 of 13 nxp semiconductors BUJ302AX npn power transistor 5. thermal characteristics 6. isolation characteristics table 5. thermal characteristics symbol parameter conditions min typ max unit r th(j-h) thermal resistance from junction to heatsink with heatsink compound; see figure 5 --4.8k/w r th(j-a) thermal resistance from junction to ambient in free air - 55 - k/w fig 5. transient thermal impedance from junction to heatsink as a function of pulse duration 001aag169 10 ? 2 10 ? 1 1 10 z th(j-h) (k/w) 10 ? 3 t p (s) 10 ? 6 10 2 10 10 ? 3 10 ? 5 1 10 ? 1 10 ? 2 10 ? 4 t p t p 1/f p t 1/f = = 0.5 0.2 0.1 0.05 0.02 0 table 6. isolation characteristics symbol parameter conditions min typ max unit v isol(rms) rms isolation voltage 50 hz f 60 hz; rh 65 %; t h =25c; from all terminals to external heatsink; clean and dust free - - 2500 v c isol isolation capacitance from collector to external heatsink ; f = 1 mhz; t h =25c -10-pf
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 6 of 13 nxp semiconductors BUJ302AX npn power transistor 7. characteristics table 7. characteristics symbol parameter conditions min typ max unit static characteristics i ces collector-emitter cut-off current v be =0v; v ce = 1050 v; t j =25c - 0.2 10 a i ceo collector-emitter cut-off current v ce =400v; i b =0a; t h = 25 c - 10 250 a v (br)ebo open-collector emitter-base breakdown voltage i b =1ma; i c =0a; t h =25c 1519- v v ceosus collector-emitter sustaining voltage i b =0a; i c =10ma; l c =25mh; t h = 25 c; see figure 6 ; see figure 7 400 470 - v v cesat collector-emitte r saturation voltage i c =1a; i b = 0.2 a; t h =25c; see figure 8 ; see figure 9 - 0.15 0.5 v i c =3.5a; i b =1a; t h =25c; see figure 8 ; see figure 9 -0.61.5v v besat base-emitter saturation voltage i c =3.5a; i b =1a; t h =25c; see figure 10 -1.11.5v h fe dc current gain i c =0.1a; v ce =5v; t h =25c; see figure 11 48 66 100 i c =0.8a; v ce =3v; t h =25c; see figure 12 25 42 50 dynamic characteristics t s storage time i c =2.5a; i bon = 0.5 a; i boff =-0.5a; r l =60 ? ; v bb =-5v; t h =25c; resistive load; t p = 300 s; see figure 13 ; see figure 14 --3.5s t f fall time - - 500 ns fig 6. test circuit for collector-emitter sustaining voltage fig 7. oscilloscope display for collector-emitter sustaining voltage test waveform 001aab9 87 horizontal 1 300 6 v vertical oscilloscope 50 v 100 to 200 30 hz to 60 hz 001aab988 v ce (v) min v ceosus i c (ma) 10 100 250 0
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 7 of 13 nxp semiconductors BUJ302AX npn power transistor fig 8. collector-emitter saturation voltage as a function of collector current; typical values fig 9. collector current as a function of collector-emitter voltage; typical values fig 10. base-emitter saturation voltage as a function of collector current; typical values fig 11. dc current gain as a function of collector current; typical values i c (a) 10 -2 10 1 10 -1 003aaf994 1 10 -1 10 v cesat (v) 10 -2 t j = 25 c t j = 125 c v ce (v) 010 8 46 2 003aaf996 2 4 6 i c (a) 0 i b = 0.2 a 0.4 a 0.6 a 0.8 a 1.0 a 1.2 a 1.4 a i c (a) 10 -2 10 1 10 -1 003aaf993 0.6 0.8 0.4 1.0 1.2 v besat (v) 0.2 t j = 25 c t j = 125 c 003aaf992 i c (a) 10 -2 10 1 10 -1 10 10 2 h fe 1 v ce = 5 v t j = 25 c t j = 125 c
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 8 of 13 nxp semiconductors BUJ302AX npn power transistor fig 12. dc current gain as a function of collector current; typical values fig 13. test circuit for resistive load switching fig 14. switching times waveforms for resistive load 003aaf991 i c (a) 10 -2 10 1 10 -1 10 10 2 h fe 1 v ce = 3 v t j = 25 c t j = 125 c 001aab989 t p r b v im 0 r l dut v cc t 001aab99 0 i c i b 10 % 10 % 90 % 90 % t on t off t s t f t t i bon ? i boff i con t r 30 ns
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 9 of 13 nxp semiconductors BUJ302AX npn power transistor 8. package outline fig 15. package outline sot186a (to-220f) references outline version european projection issue date iec jedec jeita sot186a 3-lead to-220f 0 5 10 mm scale plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead to-220 'full pack' sot186 a a a 1 q c k j notes 1. terminal dimensions within this zone are uncontrolled. 2. both recesses are ? 2.5 0.8 max. depth d d 1 l l 2 l 1 b 1 b 2 e 1 e b w m 1 23 q e p t unit d b 1 d 1 e q q p l c l 2 (1) max. e 1 a 5.08 3 mm 4.6 4.0 a 1 2.9 2.5 b 0.9 0.7 1.1 0.9 b 2 1.4 1.0 0.7 0.4 15.8 15.2 6.5 6.3 e 10.3 9.7 2.54 14.4 13.5 t (2) 2.5 0.4 l 1 3.30 2.79 j 2.7 1.7 k 0.6 0.4 2.6 2.3 3.0 2.6 w 3.2 3.0 dimensions (mm are the original dimensions) 02-04-09 06-02-14 mounting base
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 10 of 13 nxp semiconductors BUJ302AX npn power transistor 9. revision history table 8. revision history document id release date data sheet status change notice supersedes BUJ302AX v.2 20110328 product data sheet - BUJ302AX v.1 modifications: ? the format of this data sheet has been redesigne d to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. BUJ302AX v.1 19980801 objective specification - -
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 11 of 13 nxp semiconductors BUJ302AX npn power transistor 10. legal information 10.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term 'short data sheet' is explained in section "definitions". [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple de vices. the latest product status information is available on the internet at url http://www.nxp.com . 10.2 definitions draft ? the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 10.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective document status [1] [2] product status [3] definition objective [short] data sheet development this document contai ns data from the objective spec ification for product developmen t. preliminary [short] data sheet qua lification this document contains data from the preliminary specification. product [short] data sheet production this doc ument contains the pr oduct specification.
BUJ302AX all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 02 ? 28 march 2011 12 of 13 nxp semiconductors BUJ302AX npn power transistor agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any licens e under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulati ons. export might require a prior authorization from national authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 10.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. adelante , bitport , bitsound , coolflux , coreuse , desfire , ez-hv , fabkey , greenchip , hipersmart , hitag , i2c-bus logo, icode , i-code , itec , labelution , mifare , mifare plus , mifare ultralight , moreuse , qlpak , silicon tuner , siliconmax , smartxa , starplug , topfet , trenchmos , trimedia and ucode ? are trademarks of nxp b.v. hd radio and hd radio logo ? are trademarks of ibiquity digital corporation. 11. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors BUJ302AX npn power transistor ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 28 march 2011 document identifier: BUJ302AX please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 12. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 general description . . . . . . . . . . . . . . . . . . . . . .1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 thermal characteristics . . . . . . . . . . . . . . . . . . .5 6 isolation characteristics . . . . . . . . . . . . . . . . . . .5 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 10 legal information. . . . . . . . . . . . . . . . . . . . . . . . 11 10.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 10.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 10.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 10.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12 11 contact information. . . . . . . . . . . . . . . . . . . . . .12

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